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ADHESIVE, THERMAL CONDUCTIVE
Weight: 5g SVHC: No SVHC (19-Dec-2012)
Adhesive Applications: Bonding, Thermal Heat Sink
Material: Epoxyd
Operating Temperature Max: 149°C
Operating Temperature Min: -56°C
Temperature Resistance: 120 °Ccm/W
Thermal Conductivity: 0.822W/m.K
Weight Min: 5g
